Präsentationen und Poster vom iNNOVATION fORUM 2010

Download alle Poster (.zip-file 30MB)

Download alle Präsentationen (.zip-file 48MB)

KEYNOTES: 

				Dr. T. Link, MicroMountains Applications; Trends in MicroTechnologies and Applications
				Dr. M.J. Thul, Institut für Technologie und Arbeit e.V.; Innovationmanagement beyond technology
				U. Remer, 2E mechatronic GmbH & Co.KG; An efficient cooperation developing an innovative microsystem product
				Prof. Dr. H. Reinecke, HSG-IMIT; Innovative Micro-Replication Technologies
				Dr. T. Walther, Arburg GmbH + Co. KG; Trends in MicroInjection Moulding
				Prof. Dr. T. Tawakoli, Competence Center for Grinding and Superfinishing; New innovative process, tools and machine for surface finishing
Session 1: MIKROTECHNOLOGIEN
				M. Zülch, IKFF - Universität Stuttgart; Application Range of Inductive Heating in Plasctics Processing
				Dr. N. Salk, Fraunhofer IFAM; Micro injection moulding for the medical technology
				Dr. V. Piotter, Karlsruher Institut für Technologie (KIT); New Developments in Micro Injection Moulding - Multi-Component Technology
				Dr. V. Mayer, HSG-IMAT; Injection moulded micro fluidic devices
				M. Kübler, Heilbronn University; Manufacturing of Macroscopic Plastic Parts Having Microstructures
				Dr. T. Studnitzky, Fraunhofer IFAM; Manufacturing of 3D-microstructures with screen printing
				M. Oettle, Paul Horn GmbH; Micro cutting tools – small but powerfull and high demanding
				F. Mahr, Fraunhofer IPK; Process Machine Interactions in MicroMilling
				Prof. Dr. U. Mescheder, Furtwangen University; Optimization of surface quality of 3D silicon masterforms for injection molding of optical micro element
				J. Holoubek & Dr. R. Thapliyal, Innovative Sensor Technology AG; Thin Film Based Sensors: Standard Components to Complex Customer Specific Project
				A. Kain, IMTEK - Institut für Mikrosystemtechnik; Printing of Customized Masks and Moulds
				H. Willeck, HSG-IMAT; Printing of miniaturised sensor elements on thermoplastic packages
				T. Burkhardt, Fraunhofer IOF; Soldering of hermetically sealed windows for biomedical devices
				F. Haase, MicroMountains Applications; Passivation using PARYLENE
				P. Volz, 3D-Labs GmbH; The Art of Prototyping

Session 2: SENSORIK, AKTORIK UND MESSSYSTEME

				M. Kunze, HSG-IMIT; Thermal Dewpoint Sensing: A new approach for dewpoint detection and humidity sensing
				G. Varma, First Sensor Technology GmbH; Role of Piezoresistive Pressure Sensors in Microsystems
				S. Wouters, POSIC SA; Single-chip inductive encoder
				L. Moreno-Hagelsieb, SENSOI; Low-power and high-temperature sensors and MEMS in SOI technology
				Dr. F. Betschon, vario-optics ag; Electro-optical circuit board technology
				K.-P. Fritz, HSG-IMAT; High performance dispensing system
				R. Landriscina, Physik Instrumente (PI) GmbH & Co.KG; Highly Compact Ultrasonic Piezomotors: An Efficient, Alternative Drive Technology
				Dr. C. Müller, IMTEK - Institut für Mikrosystemtechnik; Chip Integrated Micro Fuel Cells
				R. Beck, Beck GmbH Druckkontrolltechnik; Low Presse Sensor using optical measurement technique
				Dr. G. Kerkhoff, Heraeus Sensor Technology GmbH; New Dynamic Oxygen Sensor
				D. Snakenborg, microinvent; Lab-on-a-board…a microfluidic prototype platform
				Dr. T. Henning, CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH; Optical reflectancehen sensor for mobile vital signs monitoring
				C. Hindrichsen, DTU Nanotech; MEMS Applied Sensors
				Dr. S.M. Anson, Karlsruher Institut für Technologie (KIT); EUMINAfab – no fee open access to state-of-the-art micro and nano technologies
				G. Obermaier, Karlsruher Institut für Technologie (KIT); An Open Innovation Facility for Advanced Micro and Nanotechnologies
				B. Obermiller, Kompetenznetzwerk Mechatronik BW p e.V.; Cluster Mechatronics BW e.V. (KMBW)
				G. Todt, SCHOTT Leakproof Packaging of MEMS

Weitere Poster und Präsentationen:
				O. Hofherr, IMTEK Freiburg; Sensor Array for Laser-Beam Monitoring and Characterization
				W. Kapischke, Hightec MC AG; HiCoFlex® - Ultra-flexible and ultra-thin PI based Substrates with very high densities on large area panels
				W.E. Svendsen, Technical University of Denmark; Department of Micro- and Nanotechnology; Detection of Cancerous cells using Silicon Nanowires
				B. Schulze, Physik Instrumente (PI) GmbH & Co. KG; Moving -Dosing – Sensing
				Prof. Dr. U. Mescheder, Furtwangen University; Optical measurement system for biosensor applications
				T. Wiesendanger, Polytec GmbH; Measuring 3-D Dynamics and Topography of MEMS and Microstructures
				G. Würtz, Steinbeis-Transfer-Center MIT; Network PMS – Development of testing technology for electronic devices and microsystems
				A. Taschwer, HSG-IMIT; Low Power Resistive Readout for Multidimensional MEMS Sensors
				Dr. M. Will, CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH; Silicon micro sensors as integrated readout platform for colorimetric and fluorescence based opto-chemical transducers
				M. Langkamp, WWINN B.V.; Manufacturing Solutions for Micro Assembly
				J. Degler, DeSta Microcut GmbH & Co KG; Waterjet Micro and Fine Cutting Subcontracting
				Institute for System Level Integration; MEMS Prototyping